• SIP
SIP / System in Package
  • Specification

    – Die size : 3x3mm
    – Die thickness : 80關m
    – PKG body size : 4x4mm
    – PKG Profile : Max 1.0T
    – Solder ball : 0.3mm/0.50pitch
    – Advanced Surface Mount Technology
    – Fine filler mold compound
    – Miniaturization & Simplicity
    – High performance

Description

HANA Micron offers especial compact system in package that chip on component package is one of the SIP (System In Package) Generally component is allocated by side of die in the package, but in case of COC(Chip On Component), can be stacked a actual die on the components For this reason, COC can reduce the package size without embeded components. COC has benefit for cost reduction and yield improvement compared to embedded type of SIP.

  • Features

    - Wafer size 200mm/300mm available
    - Chip size : 3x3mm / 80um thickness
    - Passive chip : Crystal/Resistance/Capacitor
    - PKG Min thickness : 1.0T
    - JEDEC standard compliance
    - MSL : Level 3 @ 240꼦

  • Applications

    - TDMB
    - SiP Products
    - Smart phone
    - Tablet PC
    - Mobile App