MCP / Multi chip PKG
  • Specification

    – Die Thickness (max): down to 40um
    – Wire diameter: 0.6~1.0mil
    – Marking: Laser
    – Lead inspection: Optical
    – Mold Cap: 0.3~0.7mm
    – Pack/ship options: JEDEC Tray

Description

HANA Micron’s MCP(Multi Chip Package) technology enables the stacking of a wide range of different semiconductor devices to deliver the high level of silicon integration and area efficiency required in portable multi-media products.

MCP utilizes high density thin core substrates, advanced materials (ie: thin film die attach adhesive, fine filler epoxy mold compound), along with leading-edge wafer thinning, die attach, wire bonding and molding capabilities to stack multiple devices in a conventional fine pitch BGA (FBGA) surface mount component.
These advanced assembly capabilities in combination with HANA Micron’s expertise in design and test, enable stacks up to 16 active devices while optimizing yield and mounted height requirements.
Lead free and halogen free compatible material sets are available.

HANA Micron’s FBGA is available in a broad range of JEDEC standard body sizes with LF/TF/VF/WFBGA-SD2 (<0.8mm), LF/TF/VF/WFBGA-SD4 (<0.8mm ), TF/VF/WF/ /FLGA(<0.5mm) thickness. Due to their small size and I/O density, HANA Micron’s FBGA product family is an excellent choice for new devices requiring a small footprint size and low mounted height.

  • Features

    - 48 to 464 lead counts available
    - Up to 21mm body size available
    - 0.40 to 1.00mm Ball pitch
    - Thin, lightweight, space saving package
    - JEDEC standard compliance
    - Pb-Free, RoHS compliant & Green BOM
    - BT laminate materials(2~4 metal layers)
    - Wide range of open tool substrate available
    - Short traces for excellent electrical inductance
    - Pb free solder balls down to 0.2mm ball size

  • Applications

    - Cellular phone
    - DSC/DVC
    - Mobile Game Machine
    - MP3, PDA
    - Any Mobile

Single chip / FBGA_Single chip
  • Specification

    – Die Thickness (max): 3.5mil ~ 10.0mil
    – Wire diameter: 0.7~1.2mil
    – Marking: Laser
    – Lead inspection: Optical
    – Mold Cap: 0.3~0.7mm
    – Pack/ship options: JEDEC Tray

Description

HANA Micron’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals.
The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology packaging solution for high performance and/or portable applications.
The use of the latest materials and advanced assembly infrastructure produces a reliable and cost effective package. Lead free and halogen free compatible material sets are available.

HANA Micron’s FBGA is available in a broad range of JEDEC standard body sizes with LF/TF/VF/WFBGA (<0.8mm ), TF/VF/WF/ XFLGA(<0.5mm) thickness.
Due to their small size and I/O density, HANA Micron’s FBGA product family is an excellent choice for new devices requiring a small footprint size and low mounted height.

  • Features

    - 48 to 464 lead counts available
    - Up to 21mm body size available
    - 0.40 to 1.00mm Ball pitch
    - Thin, lightweight, space saving package
    - JEDEC standard compliance
    - Pb-Free, RoHS compliant & Green BOM
    - BT laminate materials(2~4 metal layers)
    - Wide range of open tool substrate available
    - Short traces for excellent electrical inductance
    - Pb free solder balls

  • Applications

    - Analog
    - ASIC
    - Wireless RF
    - Memory
    - Micro Controller
    - Cell Phone
    - Notebook

BOC / Board On Chip
  • Specification

    – Die Thickness (max): 4.0mil~12 mil
    – Wire diameter: 0.7~1.2mil
    – Marking: Laser
    – Lead inspection: Optical
    – Mold Cap: 0.5~0.7mm
    – Pack/ship options: JEDEC Tray

Description

HANA Micron’s BOC is a cost effective package ideal for memory devices with center bond requirements. BOC is a laminated-based, nearly chip-scale package with the die mounted top-side down.

Wire bonds are made through a cavity in the center of substrate and both the cavity and top-side of the package are over molded. BOC packages enable a small footprint and excellent electrical performance for high frequency memory due to their wire length short as well as die stacking is available up to 2.

  • Features

    - 60 to 136 lead counts available
    - Up to 21mm body size available
    - 0.40 to 1.00mm Ball pitch
    - Low profile 1.00mm and below possible
    - JEDEC standard compliance
    - Pb-Free, RoHS compliant & Green BOM
    - BT laminate materials(2~4 metal layers)
    - Wide range of open tool substrate available

  • Applications

    - PDA
    - Wireless RF
    - Memory(DDR SDRAM)
    - Micro Controller
    - Cell Phone