• FOWLP is an answer to the demand for fanning out I/Os from a die area to increase package pitch or I/O count. E.g. increasing the I/O count for an area-constrained WLCSP.
HANAMICRON’s FOWLP provides flexible routing and footprint options for your BGA style package.
Single IC package

Characteristic of this package is one embedded component and conductor layers on only one side of the component.

Multi chip package

Two or more components are embedded in the EMC material and conductor layers on only one side of the components.

This gives you a number of important benefits
Design flexibility

HANA Micron’s FOWLP technology gives unparalleled design flexibility, since the component is located in the EMC instead of on top of the PCB. One of the greatest benefits of FOWLP technology is the improvement of routing capability. FOWLP design are simpler and fewer routing layers are usually needed and even the innermost layer can efficiently used for routing.

High applicability

Already proven in handheld consumer electronics and telecom applications, HANA Micron’s FOWLP technology is adaptable to almost any electronic product.

Variable component thickness acceptable

Unlike some other technologies, HANA Micron’s FOWLP technology enables, that component thickness within one module may be different. The molded wafer is built around components is not affected by varying component size.

FOWLP Development Roadmap
– 3D FOWLP such as FOWLP-POP & FOWLP-SiP is Hana Micron’s own technology.
– Whole process can be proceeded including bumping by ourselves.

FOWLP Development Roadmap
Items Current 2018 2019
1H 2H
Max. Package size (mm) 10X10 12X12 12X12 15X15
PKG height w/ solder ball (mm) 0.5 0.4 0.35 0.35
Min. Ball pitch (mm) 0.4 0.35 0.35 0.30
Min RDL L/S (um) 10/10 8/8 8/8 5/5
Die pad size (um) 60um 50um 50um < 50um
No. of RDL metal layer 1 2 > 2
No. of component in package (Active) 3 > 3 > 3 > 3
Clearance btw chips Min. 500um Min. 300um Min. 300um Min. 150um
Clearance btw chip & PKG edge Min. 100um Min. 80um Min. 80um Min. 50um
Min. Passive component size 1005/0603 0402 0201
Mold via size, 3D Approach (um) - 200 200 < 200
Mold via pitch, 3D Approach (um) - 400 400 < 400
Process Flow of FOWLP

Process Flow of FOWLP-POP (C2FOTM)